ETEL S.A.
Documents
134
Back-end Semiconductor applications: Breaking through motion system solution to meet accuracy and throughput imultaneously
8 Pages
1.11 MB
TELICA has been designed to fulfill the new and very stringent requirements of advanced packages such as FO-WLP (Fan-Out Wafer Level Package) and FO-PLP (Panel Level Fan-Out packages). It also covers perfectly the needs of all the flipchip
processes.
processes.
Pages
