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ETEL S.A. Products
ETEL S.A.
Positioning systems
CHARON2 STACKED SYSTEM
CHARON2 stacked system
CHARON2 is a new semiconductor-oriented XY stacked system, backward compatible with existing modules and options. CHARON2 design extends CHARON use cases into the space of higher dynamics and larger payloads, with further improvement on accuracy and repeatability. Exceeding 1g acceleration and 1 m/s speed at doubled payload, while delivering an absolute positioning accuracy below 1 µm, CHARON2 represents a turnkey motion solution for state of the art new semiconductor applications and lifetime extension initiatives.

CHARON2 remains another perfect example of ETEL vertical integration, based on proprietary IP for motors, electronics and controlling know-how, and synergy with HEIDENHAIN when relating to world-class positioning accuracy feedback. The result is a broad family of solutions serving any OEM wafer-positioning needs, process or process-control related, and ranging from a core XY to a complete system of up to 9 axes, independently controlled.

CHARON2 stems from anticipated, aligned, OEM requirements immediately fulfilled with another optimized product, reducing EOM integration costs and time-to-market efforts.

Characteristics
- Total stroke : up to 650 mm x 410 mm
- ISO 2 clean room compatible
  • CHARON2 XY
  • CHARON2 XYT
CHARON2 STACKED SYSTEM
CHARON2 STACKED SYSTEM
Motion Systems
ETEL S.A.
Positioning systems
CHARON2 STACKED SYSTEM
CHARON2 stacked system
CHARON2 is a new semiconductor-oriented XY stacked system, backward compatible with existing modules and options. CHARON2 design extends CHARON use cases into the space of higher dynamics and larger payloads, with further improvement on accuracy and repeatability. Exceeding 1g acceleration and 1 m/s speed at doubled payload, while delivering an absolute positioning accuracy below 1 µm, CHARON2 represents a turnkey motion solution for state of the art new semiconductor applications and lifetime extension initiatives.

CHARON2 remains another perfect example of ETEL vertical integration, based on proprietary IP for motors, electronics and controlling know-how, and synergy with HEIDENHAIN when relating to world-class positioning accuracy feedback. The result is a broad family of solutions serving any OEM wafer-positioning needs, process or process-control related, and ranging from a core XY to a complete system of up to 9 axes, independently controlled.

CHARON2 stems from anticipated, aligned, OEM requirements immediately fulfilled with another optimized product, reducing EOM integration costs and time-to-market efforts.

Characteristics
- Total stroke : up to 650 mm x 410 mm
- ISO 2 clean room compatible
  • CHARON2 XY
  • CHARON2 XYT
METIS PLANAR PLATFORM
METIS PLANAR PLATFORM
Motion Systems
ETEL S.A.
Positioning systems
METIS PLANAR PLATFORM
This platform, Metis, is a hybrid planar mechanical/air bearing platform dedicated to step and scan applications. It is a 6 axes platform moving in X, Y, Z and Theta directions. Dynamic flatness over the full travel as well as bidirectional repeatability are key parameters. This platform is currently used in:
- Wafer Process Control applications such as Critical Dimension and Thin film Metrology.
- Wafer scribing
- Wafer Laser Thermal Annealing

It might also be used in Back End Of Line Lithography machines (mask aligners) and in some wafer dicing application.

This platform features:
- Flatness of motion given by the air bearing
- Unlimited rotation in Theta
- Double Z integration: Coarse travel for loading/unloading and fine travel for focus adjustement
- Buit-in gravity compensator in Z (patent pending)
- Yaw correction can be done by slightly shifting the Y1 and Y2 motors
- Can be further integrated with an Active Isolation System fully controlled by ETEL
- Travels in X and Y can be made longer with some limitations on the performance

Main specifications
- Total stroke: 320 mm for XY x 12 mm for Z
- Speed: 1.2 m/s for XY, 0.1 m/s for Z and 15.7 rad/s for T
- Acceleration: 1.2 g for XY, 0.2 g for Z and 104.7 rad/s2 for T
- Position stability: ±25 nm for XY, ±15 nm for Z and ±0.2 arcsec for T
- Bidirectional repeatability: ±0.4 µm for XY, ±0.3 µm for Z and ±2 arcsec for T

Ask for the corresponding Integration Manual for more information.
VULCANO XY STACKED PLATFORM
VULCANO XY STACKED PLATFORM
Positioning system
ETEL S.A.
Positioning systems
VULCANO XY STACKED PLATFORM
The Vulcano XY system is a three-piece-design allowing a compact and cost engineered solution, coupled to mechanical bearings and high-end optical encoders.
The baseplate of the bottom axes (Y1 & Y2) is composed of 2 ironcore linear motors, controlled in a gantry mode, when used with AccurET controllers, to allow better repeatability and optimal control efficiency. The upper axis (X) is composed of a single ironcore linear motor. The use of ironcore technology offers a high force density resulting in high acceleration and speed while keeping the operating temperature at a rather low level.

The baseplate of the upper axis (X), which also holds the motor of the bottom axes (Y1 & Y2) is made of aluminum for mass optimization and dynamics. Thermal expansion is handle by flexure elements.
There are 3 linear guides on the bottom plate. The two external linear guides laying on the bottom plate of VULCANO are recirculating ball bearings while the internal one (located in the middle of the baseplate) is composed of a recirculating roller bearing. The decoupling between the three guides is made through flexural elements. Some of these elements attached to the bearing blocks of the external guides allow a translation in the X direction. Some others attached to the central rail allow a rotation around the vertical direction.

The upper axis (X) integrates 2 linear bearings. The decoupling is made via another set of flexural elements allowing a translation in the Y direction for one of the rail.

The use of this platform is suitable for, but not limited to:
- Wafer Process Control applications such as Overlay Metrology, Critical Dimension and Thin film Metrology
- Back-end: specific flip-chip processes made on large panels/substrates

Characteristics
- Compact footprint
- Nanometer position stability
- Short move and settle times
- High dynamics
- High bidirectional repeatability
- High position stability
- ISO class 1 clean room compatibility

Ask for the corresponding Integration Manual for more information.
VULCANO XYT STACKED PLATFORM
VULCANO XYT STACKED PLATFORM
Positioning system
ETEL S.A.
Positioning systems
VULCANO XYT STACKED PLATFORM
The Vulcano XYT platform is made up of the standard Vulcano XY outfitted with the RTTB rotary module which includes high resolution encoder coupled to an outstanding mechanical bearing.
The use of this platform is suitable for, but not limited to:
-Wafer Process Control applications such as Overlay Metrology, Critical Dimension and Thin film Metrology
- Back-end: specific flip-chip processes made on large panels/substrates

Characteristics
- Compact footprint
- Nanometer position stability
- Short move and settle times
- High dynamics
- High bidirectional repeatability
- High position stability
- ISO class 1 clean room compatibility

Ask for the corresponding Integration Manual for more information.
VULCANO XYZ3TH STACKED PLATFORM
VULCANO XYZ3TH STACKED PLATFORM
Positioning system
ETEL S.A.
Positioning systems
The Vulcano XYZ3TH platform is made up of the standard Vulcano XY outfitted with the Z3TH combined module. This 4 degrees of freedom module, provides 364° Theta rotation, double Z-axes, a coarse one for wafer loading and unloading, and a fine one for focus adjustment, as well as a Tip and Tilt correction over ±0.1°.

Characteristics
- Compact footprint
- Nanometer position stability
- High dynamics: 2.5 g, 1.5 m/s
- Low move and settle times
- ISO1 clean room compatible
- Tip-Tilt correction over ±0.1°
- Double Z integration
- Built-in gravity compensator in Z
- Outstanding Z straightness
- Enhanced Z repeatability and jitter
- Ability to correct stage flatness
- Built-in vacuum supply at chuck level

Ask for the corresponding Integration Manual for more information.
Z3TH COMBINED MODULE
Z3TH COMBINED MODULE
Combined Module
ETEL S.A.
Positioning systems
Z3TH COMBINED MODULE
The Z3TH Combined Module is enlarging the scope of modules that can sit on top of the existing XY platforms. The Z3TH, 4 degrees of freedom module, provides 364° Theta rotation, double Z-axes, a coarse one for wafer loading and unloading, and a fine one for focus adjustment, as well as a Tip and Tilt correction over ±0.1°. This Z3TH module is a nice alternative to piezo based Z actuators, eliminating the hysteresis and non-linearity in open loop while offering better tracking error during movement, repeatability, and move and settle performance yet over much longer travels.

The Z3TH module is primarily dedicated to front-end type of applications and provides a right solution to cope with any applications requiring:
- Alignment between a process tool and a substrate
- Mapping of flatness
- Move and settle improvement

First applications are related to back-end lithography and wafer process control.

Characteristics
- 364° Theta rotation
- Tip and tilt correction over ±0.1° for leveling and for move and settle improvement
- Vacuum feed-through to the chuck level
- Double Z integration: coarse travel for loading/unloading and fine travel for focus adjustment
- ISO class 1 clean room compatibility
- Low radial axial and radial runout of ±1 µm

Ask for the corresponding Integration Manual for more information.
ZT COMBINED MODULE
ZT COMBINED MODULE
Combined module
ETEL S.A.
Positioning systems
ZT COMBINED MODULE
The ZT box is a module combining two degrees of freedom, in Z and Theta, within one single unit. Two actuations are possible along the Z direction, a coarse one and a fine one. This module can be used in a standalone mode or mounted on top of an XY platform. This module is especially well suited for wafer process control applications such as thin film metrology, critical dimensions, etc.

Characteristics
- Infinite rotation
- Built-in vacuum supply at wafer chuck level
- Built-in gravity compensator
- ISO1 clean room compatible thanks to vacuum suction
- Coarse Z axis with 12 mm stroke for wafer loading/unloading and fine Z with 4 mm stroke for focus adjustment
- Version without a coarse Z can be done
- Very good Z jitter as well as move and settle

Main specifications
- Bidirectional repeatability: ±0.3 µm for Z and ±2 arcsec for T
- Position accuracy: ±0.6 µm for Z and ±3 arcsec for T
- Speed up to: 0.1 m/s for Z and 15.7 rad/s for T
- Acceleration up to: 0.2 g for Z and 104.7 rad/s² for T
- Position stability: ±5 nm for Z and ±0.2 arcsec for T
- Load capacity: 1 kg

Ask for the corresponding Integration Manual for more information.