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UNITED GRINDING Group Products
United Grinding Group Management AG
Laser eroding machines

EWAG LASER LINE ULTRA

EWAG LASER LINE ULTRA - pure performance with light

EWAG uses an Ultrashort-Pulse Laser for the removal process. This works in the Pico seconds cycle time in the direct evaporation process without significant heat input (cold ablation). The material properties are fully preserved, while increasing the service life of the tool. Also, the Ultrashort pulse in conjunction with high repetition rates lead to a high surface quality. The unique 8-axis kinematics concept enables the LASER LINE ULTRA for machining complex geometries in one clamping. Incorporating a 6-axis robot ensures maximum productivity in the poor man multi-shift operations.

• 5 CNC axis - machine tools plus overlay 3-CNC axis Laserstrahlfuhrung
• Linear axes X, Y, Z with glass scales
• Axis B, C with torque direct drive
• Complete machining of cutting, Hohlraumen and chip lead levels with subsequent marking in one clamping
• For all common cutting materials incl. HM
• For indexable inserts & Rotationally symmetrical tools tool
This description was translated from German to English by "Bing Translator".
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EWAG LASER LINE PRECISION
EWAG LASER LINE PRECISION
All-in-one laser precision machining of diamond tools
United Grinding Group Management AG
Laser eroding machines
EWAG LASER LINE PRECISION
The LASER LINE PRECISION is the perfect machine for getting started with laser technology for modern tool manufacturers. The latest fibre laser technology in the green-wavelength range provides efficient machining results in the commercially available diamond cutting materials, such as CBN, PCD and CVD-D. The EWAG Laser Touch Machining® Process can be used to achieve very complex geometries with excellent surface quality. The LASER LINE PRECISION is the most compact laser production center for diamond tools in the world.

The LASER LINE PRECISION replaces previous methods for grinding and eroding ultra-hard materials, such as PCD and CVD-D, through the use of lasers. It holds rotationally symmetrical tools of up to 200 mm diameter and up to 250 mm length as well as indexable inserts from 3 mm inscribed diameter and up to 50 mm circumscribed diameter.
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