New Vulcano XY: the modular standard platform
ETEL is proud to present its new VULCANO XY system – a three-piece-design allowing a compact and cost engineered solution, coupled to mechanical bearings and high-end optical encoders. This platform can easily be coupled with a rotary module RTTB or the brand new Z3THcombined module. This latter provides a Tip and Tilt correction, a double Z-axes, 364° Theta rotation and 4 degrees of freedom.
The Vulcano XY system is a three-piece-design allowing a compact and cost engineered solution, coupled to mechanical bearings and high-end optical encoders.
The baseplate of the bottom axes (Y1 & Y2) is composed of 2 ironcore linear motors, controlled in a gantry mode, when used with AccurET controllers, to allow better repeatability and optimal control efficiency. The upper axis (X) is composed of a single ironcore linear motor. The use of ironcore technology offers a high force density resulting in high acceleration and speed while keeping the operating temperature at a rather low level.
The baseplate of the upper axis (X), which also holds the motor of the bottom axes (Y1 & Y2) is made of aluminum for mass optimization and dynamics. Thermal expansion is handle by flexure elements.
There are 3 linear guides on the bottom plate. The two external linear guides laying on the bottom plate of VULCANO are recirculating ball bearings while the internal one (located in the middle of the baseplate) is composed of a recirculating roller bearing. The decoupling between the three guides is made through flexural elements. Some of these elements attached to the bearing blocks of the external guides allow a translation in the X direction. Some others attached to the central rail allow a rotation around the vertical direction. The upper axis (X) integrates 2 linear bearings. The decoupling is made via another set of flexural elements allowing a translation in the Y direction for one of the rail.
The use of this platform is suitable for, but not limited to:
- Wafer Process Control applications such as Overlay Metrology, Critical Dimension and Thin film Metrology
- Back-end: specific flip-chip processes made on large panels/substrates
Characteristics
- Compact footprint
- Nanometer position stability
- Short move and settle times
- High dynamics
- High bidirectional repeatability
- High position stability
- ISO class 1 clean room compatibility
Ask for the corresponding Integration Manual for more information.
Main features
| Description | Y1-Y2 (bottom) | X (upper) |
| Travel range | up to 650 mm | up to 650 mm |
| Maximum speed | up to 1.5 m/s | up to 1.5 m/s |
| Maximum acceleration | up to 25 m/s2 | up to 25 m/s2 |
| Position stability | <±1 nm | <±1 nm |
| Bidirectional repeatability | down to ±250 nm | down to ±250 nm |
| Move and settle time (25 mm within ±100 nm) |
<130 ms | <130 ms |
| Maximum payload | - | 40 kg |
The Z3TH Combined Module is enlarging the scope of modules that can sit on top of the existing XY platforms. The Z3TH, 4 degrees of freedom module, provides 364° Theta rotation, double Z-axes, a coarse one for wafer loading and unloading, and a fine one for focus adjustment, as well as a Tip and Tilt correction over ±0.1°. This Z3TH module is a nice alternative to piezo based Z actuators, eliminating the hysteresis and non-linearity in open loop while offering better tracking error during movement, repeatability, and move and settle performance yet over much longer travels.
The Z3TH module is primarily dedicated to front-end type of applications and provides a right solution to cope with any applications requiring:
- Alignment between a process tool and a substrate
- Mapping of flatness
- Move and settle improvement
First applications are related to back-end lithography and wafer process control.
Characteristics
- 364° Theta rotation
- Tip and tilt correction over ±0.1° for leveling and for move and settle improvement
- Vacuum feed-through to the chuck level
- Double Z integration: coarse travel for loading/unloading and fine travel for focus adjustment
- ISO class 1 clean room compatibility
- Low radial axial and radial runout of ±1 µm
Ask for the corresponding Integration Manual for more information.
Main features
| Description | Fine Z | Tip-Tilt | Coarse Z | Theta |
| Travel range | ±2 mm | ±0.1° | 12 mm | 364° |
| Maximum speed | 0.05 m/s | - | 0.1 m/s | 10 rad/s |
| Maximum acceleration | 1 m/s2 | - | 2 m/s2 | 55 rad/s2 |
| Position stability | ±10 nm | - | - | ±0.004 arcsec |
| Bidirectional repeatability | ±10 nm | - | - | ±0.35 arcsec |
| Move and settle time (100 µm within ±30 nm) |
45 ms | - | - | - |
| Move and settle time (180° within ±20 µ°) |
525 ms | |||
| Maximum payload | - | - | 0.15 kg | 2 kg |
ETEL S.A.
Zone Industrielle
CH-2112 Môtiers
Switzerland
T +41 (0)32 862 01 00
F +41 (0)32 862 01 01
[email protected]
www.etel.ch
ETEL is proud to present its new VULCANO XY system – a three-piece-design allowing a compact and cost engineered solution, coupled to mechanical bearings and high-end optical encoders. This platform can easily be coupled with a rotary module RTTB or the brand new Z3THcombined module. This latter provides a Tip and Tilt correction, a double Z-axes, 364° Theta rotation and 4 degrees of freedom.
The Vulcano XY system is a three-piece-design allowing a compact and cost engineered solution, coupled to mechanical bearings and high-end optical encoders.
The baseplate of the bottom axes (Y1 & Y2) is composed of 2 ironcore linear motors, controlled in a gantry mode, when used with AccurET controllers, to allow better repeatability and optimal control efficiency. The upper axis (X) is composed of a single ironcore linear motor. The use of ironcore technology offers a high force density resulting in high acceleration and speed while keeping the operating temperature at a rather low level.
The baseplate of the upper axis (X), which also holds the motor of the bottom axes (Y1 & Y2) is made of aluminum for mass optimization and dynamics. Thermal expansion is handle by flexure elements.
There are 3 linear guides on the bottom plate. The two external linear guides laying on the bottom plate of VULCANO are recirculating ball bearings while the internal one (located in the middle of the baseplate) is composed of a recirculating roller bearing. The decoupling between the three guides is made through flexural elements. Some of these elements attached to the bearing blocks of the external guides allow a translation in the X direction. Some others attached to the central rail allow a rotation around the vertical direction. The upper axis (X) integrates 2 linear bearings. The decoupling is made via another set of flexural elements allowing a translation in the Y direction for one of the rail.
The use of this platform is suitable for, but not limited to:
- Wafer Process Control applications such as Overlay Metrology, Critical Dimension and Thin film Metrology
- Back-end: specific flip-chip processes made on large panels/substrates
Characteristics
- Compact footprint
- Nanometer position stability
- Short move and settle times
- High dynamics
- High bidirectional repeatability
- High position stability
- ISO class 1 clean room compatibility
Ask for the corresponding Integration Manual for more information.
Main features
| Description | Y1-Y2 (bottom) | X (upper) |
| Travel range | up to 650 mm | up to 650 mm |
| Maximum speed | up to 1.5 m/s | up to 1.5 m/s |
| Maximum acceleration | up to 25 m/s2 | up to 25 m/s2 |
| Position stability | <±1 nm | <±1 nm |
| Bidirectional repeatability | down to ±250 nm | down to ±250 nm |
| Move and settle time (25 mm within ±100 nm) |
<130 ms | <130 ms |
| Maximum payload | - | 40 kg |
The Z3TH Combined Module is enlarging the scope of modules that can sit on top of the existing XY platforms. The Z3TH, 4 degrees of freedom module, provides 364° Theta rotation, double Z-axes, a coarse one for wafer loading and unloading, and a fine one for focus adjustment, as well as a Tip and Tilt correction over ±0.1°. This Z3TH module is a nice alternative to piezo based Z actuators, eliminating the hysteresis and non-linearity in open loop while offering better tracking error during movement, repeatability, and move and settle performance yet over much longer travels.
The Z3TH module is primarily dedicated to front-end type of applications and provides a right solution to cope with any applications requiring:
- Alignment between a process tool and a substrate
- Mapping of flatness
- Move and settle improvement
First applications are related to back-end lithography and wafer process control.
Characteristics
- 364° Theta rotation
- Tip and tilt correction over ±0.1° for leveling and for move and settle improvement
- Vacuum feed-through to the chuck level
- Double Z integration: coarse travel for loading/unloading and fine travel for focus adjustment
- ISO class 1 clean room compatibility
- Low radial axial and radial runout of ±1 µm
Ask for the corresponding Integration Manual for more information.
Main features
| Description | Fine Z | Tip-Tilt | Coarse Z | Theta |
| Travel range | ±2 mm | ±0.1° | 12 mm | 364° |
| Maximum speed | 0.05 m/s | - | 0.1 m/s | 10 rad/s |
| Maximum acceleration | 1 m/s2 | - | 2 m/s2 | 55 rad/s2 |
| Position stability | ±10 nm | - | - | ±0.004 arcsec |
| Bidirectional repeatability | ±10 nm | - | - | ±0.35 arcsec |
| Move and settle time (100 µm within ±30 nm) |
45 ms | - | - | - |
| Move and settle time (180° within ±20 µ°) |
525 ms | |||
| Maximum payload | - | - | 0.15 kg | 2 kg |
ETEL S.A.
Zone Industrielle
CH-2112 Môtiers
Switzerland
T +41 (0)32 862 01 00
F +41 (0)32 862 01 01
[email protected]
www.etel.ch