This platform, Metis, is a hybrid planar mechanical/air bearing platform dedicated to step and scan applications. It is a 6 axes platform moving in X, Y, Z and Theta directions. Dynamic flatness over the full travel as well as bidirectional repeatability are key parameters. This platform is currently used in: - Wafer Process Control applications such as Critical Dimension and Thin film Metrology. - Wafer scribing - Wafer Laser Thermal Annealing It might also be used in Back End Of Line Lithography machines (mask aligners) and in some wafer dicing application. This platform features: - Flatness of motion given by the air bearing - Unlimited rotation in Theta - Double Z integration: Coarse travel for loading/unloading and fine travel for focus adjustement - Buit-in gravity compensator in Z (patent pending) - Yaw correction can be done by slightly shifting the Y1 and Y2 motors - Can be further integrated with an Active Isolation System fully controlled by ETEL - Travels in X and Y can be made longer with some limitations on the performance Main specifications - Total stroke: 320 mm for XY x 12 mm for Z - Speed: 1.2 m/s for XY, 0.1 m/s for Z and 15.7 rad/s for T - Acceleration: 1.2 g for XY, 0.2 g for Z and 104.7 rad/s2 for T - Position stability: ±25 nm for XY, ±15 nm for Z and ±0.2 arcsec for T - Bidirectional repeatability: ±0.4 µm for XY, ±0.3 µm for Z and ±2 arcsec for T Ask for the corresponding Integration Manual for more information.