LAPPING The OKAMOTO Product range contains machine for the abrasive process for semiconductor materials. From slicing the Ingots to the final device, our target is the best quality and highest precision. Our products are one step further in the direction of minimising and flexibility.
ECONOMICAL POLISHING AND LAPPING OKAMOTO is the only manufacturer to offer a total abrasive technology solution world wide. Not only grinding but also lapping and polishing equipment and process development. For further information please contact Okamoto Europe. Final Polishing OKAMOTO is the only manufacturer to offer a total abrasive solution lapping and polishing equipment.
Finishing system for polishing/lapping irregular profiles
For extremely fine lapping of irregular profiles, AERO LAP is also equipped for small tools and parts. The special suspension multicone enables an automated lapping process without changing the geometry of the components to be worked. Multicone is a special elastic carrier medium to which diamond powder has been added. The media is directed onto the workpiece via a nozzle from a special turbine.
Easy lapping of irregular profiles Improves tool life of all tools (drills, milling cutters, form punches, etc.) Suitable for PVD/CVD coating (pre/mirror-gloss lapping) Negligible production of dust and odour
We use cookies to optimize our website for you and to be able to improve it continuously. By clicking the "Accept" button, you expressly agree to the use of cookies. For further information on cookies, please refer to our privacy policy.