![Quote](images/misc/quote_icon.png)
Originally Posted by
Mariss Freimanis
By solder "bumping" I prep the board beforehand with solder on each SMT pad to leave a convex shaped solder meniscus. That way there sufficient solder already there when I flux, place and hot-air each part. I remove the tweezer about a second before removing the hot air. Surface tension then pulls each part perfectly into place.
Mariss
One wonders whether there isn't some clever way to at least CNC the solder bumping. The board is a known quantity from a CNC standpoint. There's no need to load reals of components. You still have to deal with manually placing the parts and applying the hot air, but perhaps a small increment of the work prototyping would be saved.
Cheers,
BW
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