I just got back from the lab. I took a density measurement on a similar mixture to the one I was discussing with Dave as of post <A href=http://www.cnczone.com/forums/showpost.php?p=578984&postcount=3534>3534</A> The only difference is that I substituted IMSIL 1240 for G200 Zeeospheres as I don't have any G200 on hand right now. The IMSIL is not spherical so I suspect that it won't be quite as good as G200 although it is in approximately the same size range.
My measured uncorrected Phi value was 81.9%. This means that the mixture was occupying 81.9% of the volume measured in my test apparatus. With corrections for container size etc, I suspect that the true packing density will be between between 81% and 88% when I finish the correction calculations.
I intend to do a test on this mixture using 18% epoxy by volume with Hexion 813 and Isophorone Diamine as the hardener to see what the properties are. My big steel vacuum infusion mold is currently occupied with a vacuum infusion test of titanated epoxy and Novec 4432 with coarse aggregate so I haven't made a sample of the E/G reference mixture yet.
My lab notes for the day are that the reference aggregate mixture compacts down almost like a brick in the density measurement apparatus. I also noticed that using the Novec 4432 fluorosurfactant is a minor disaster without a defoaming agent. The air in the mixture stays around forever and even the tiniest amount of the epoxy mixture wants to turn to foam in the vacuum chamber. My conclusion is that Novec 4432 without a deairing agent like BYK A-525 (which I don't have yet) is likely to cause serious problems: Don't bother making up a batch with Novec if you don't have a deairing agent.
On another front, I pulled a couple papers from the Journal of Applied Polymer Science and they suggest that the glass transition temperature for IPDA hardened epoxy is around 160C. This means that for maximum reaction completion, IPDA needs to be cured at that high a temperature.
The other thing I found in these papers was that high temperature cures can lower the modulus of the epoxy even though they increase the glass transition temperature. It appears that long high temperature post cures greatly improve the fracture toughness of some epoxy mixtures.
Just in case anybody thinks I've given up around here, I haven't. It's just taken a long time to get everything on track and find the time to do the tests that needed to be done.
Regards all,
Cameron