Hello,

I finished milling the "larger_board". You can see the results in the attached picture.

Settings:

1) Feeding speed = 20mm/min
2) Spindle at 22V (~7333 rpm)
3) Tool: Cheap V-bit 30°/0.1mm
4) Milling depth 50 um
5) In FlatCAM I set the tool tip to 0.2mm to get good results. Probably this is needed because my tool is not actually a 0.1mm tool and/ or my spindle has a huge runout.
6) 4 passes 40% overlap
7) Auto leveling using bCNC.
8) Added some sunflower oil on the blank pcb board. This was just an experiment because I didn't have any cutting fluid and it seems that it helped!

In this board I use 10 mil tracks. The smallest isolation distance is 0.2 mm (pad to pad for the TSSOP chip).
I edited the gcode and removed 3 out of the 4 board outlines to accelerate the milling. However, I forgot to remove a gcode command for the z axis and the machine milled a huge straight line throughout the board.
Other than that, the improvement is obvious with respect to the "cheap_v_bit.jpg?" I uploaded in the first post. What is your opinion?